Foundries takeover 200mm fab capacity in 2018; Does consolidation put innovation at risk?; A step towards keeping up with Moore's Law

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In this issue: • Foundries takeover 200mm fab capacity by 2018 • Semiconductor R&D growth slows in 2015 • Does consolidation put innovation at risk? • Imagining China's IC fab industry in 2035 • Breakthrough enables ultra-fast transport of electrical charges in polymers • A step towards keeping up with Moore's Law • IBS report electric transport across molybdenum disulfide grain boundaries • Cornell-led team creates gallium nitride power diode • Samsung, Apple continue to lead as top global semiconductor customers • Epiluvac and SAMCO collaborate to offer processing equipment for WBG materials in Nordic countries • Entegris expands R&D operations for semiconductor process liquid filtration in South Korea • Thin wafer market worth $9.17B by 2022 • Entegris announces new post-CMP cleaning solutions	Share:
Top stories Foundries takeover 200mm fab capacity by 2018 IoT drives worldwide 200mm fab capacity in 2018 back to 2006 levels. Share:    Semiconductor R&D growth slows in 2015 Industry-wide R&D expenditures grew 0.5% to a record-high $56.4 billion in 2015. Top 10 R&D spenders collectively increased expenditures by nearly 2% in the year. Share:    Does consolidation put innovation at risk? Consolidation in the semiconductor industry continues apace, with more than $100 billion in mergers and acquisitions announced in 2015, and more to come in 2016. Share:    Imagining China's IC fab industry in 2035 China has been successfully investing in technology to reach global competitiveness for many decades. Integrated circuit (IC) manufacturing technology is highly strategic for countries, enabling both economically-valuable commercial fabs as well as military power.(From SemiMD) Share:
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Tech News Breakthrough enables ultra-fast transport of electrical charges in polymers A research team at Umea University in Sweden has showed, for the first time, that a very efficient vertical charge transport in semiconducting polymers is possible by controlled chain and crystallite orientation. Share:    A step towards keeping up with Moore's Law POSTECH researchers develop a novel and efficient fabrication technology for cross-shaped memristor. Share:    IBS report electric transport across molybdenum disulfide grain boundaries The Center for Integrated Nanostructure Physics (CINAP) within IBS has reported results correlating the flake merging angle with grain boundary (GBs) properties, and proven that increasing the merging angle of GBs drastically improves the flow of electrons.  Share:    Cornell-led team creates gallium nitride power diode Making tiny switches do enormous jobs in a more efficient way than current technology allows is one of the goals of a research team led by Cornell engineering professor Huili (Grace) Xing. Share:
Business News Samsung, Apple continue to lead as top global semiconductor customers Samsung Electronics and Apple remained the top semiconductor buyers in 2015, representing 17.7 percent of the market, according to Gartner, Inc. Share:    Epiluvac and SAMCO collaborate to offer processing equipment for WBG materials in Nordic countries Sweden-based SiC CVD developer and manufacturer Epiluvac AB has entered into a collaboration with SAMCO, a semiconductor process equipment developer and manufacturer based in Japan, in which Epiluvac will introduce new clients to SAMCO in Sweden, Norway, Finland and Denmark. Share:    Entegris expands R&D operations for semiconductor process liquid filtration in South Korea Entegris, Inc. announced the expansion of its liquid filtration/purification analytical science and research and development facility in Suwon, South Korea.  Share:    Thin wafer market worth $9.17B by 2022 According to a new marketsandmarkets report, the market was valued $6.76 Billion in 2015 and estimated to reach $9.17 Billion by 2022, at a CAGR of 3.7% between 2016 and 2022. Share:
Product News Entegris announces new post-CMP cleaning solutions Entegris, Inc., a developer of yield-enhancing materials and solutions, today announced new post-chemical mechanical planarization (post-CMP) cleaning solutions for semiconductor manufacturing.  Share: