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Home 3D Integration Wafer Level Packaging Materials and Equipment
In this issue: • ITRS 2.0: Top-down system integration • Global semiconductor market achieves strong, broad-based growth in 2014 • Top 10 2015 semiconductor sales leaders forecast to include NXP/Freescale • Fifty years of Moore's Law made possible by semiconductor equipment and materials suppliers worldwide • SOI: Revolutionizing RF and expanding in to new frontiers • 3D integration: The most effective path for future IC scaling • MagnaChip to offer diversified products for Internet of Things applications • KLA-Tencor introduces new portfolio for advanced semiconductor packaging • Duke University research advances testing of 3D integrated circuits for cost-effective development of electronics • Trends in materials: The smartphone driver • Semiconductor CEOs urge congress to enact Trade Promotion Authority • Synopsys to acquire software security company Codenomicon • Samsung Galaxy S6 Edge pricier to build, cheaper to buy than comparable Apple iPhone 6 Plus • A*STAR's IME and partners to enable low cost packaging technology for system scaling within smart devices	Share:
Top News ITRS 2.0: Top-down system integrationITRS 2.0 will, for the first time, develop a top-down system-driven roadmap framework for key semiconductor industry drivers in the 2015-2030 period. (From SemiMD)Share:    Global semiconductor market achieves strong, broad-based growth in 2014Highest annual growth rate since 2010; strong growth expected again in 2015.Share:    Top 10 2015 semiconductor sales leaders forecast to include NXP/FreescaleTotal top 10 marketshare of semiconductor industry now back over 50 percent.Share:    Fifty years of Moore's Law made possible by semiconductor equipment and materials suppliers worldwideApril 2015 marks the 50th anniversary of one of the business worldÂ’'s most profound drivers, now commonly referred to as Moore's Law. Share:    SOI: Revolutionizing RF and expanding in to new frontiersSOI provides the capability to revolutionize RF Front Ends and WAN RFSOCs through innovation in radio architectures. (From SemiMD)Share:
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Tech News 3D integration: The most effective path for future IC scalingThis webcast will present game-changing monolithic 3D process flows which use the existing transistor of existing manufacturing line and existing process flows.Share:    MagnaChip to offer diversified products for Internet of Things applicationsMagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products announced today that it has kicked-off an Internet of Things (IoT) task force and will offer diversified products with ultra-low power technology in anticipation of the fast growing IoT market. Share:    KLA-Tencor introduces new portfolio for advanced semiconductor packagingKLA-Tencor Corporation announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830.Share:    Duke University research advances testing of 3D integrated circuits for cost-effective development of electronicsDuke University researchers are working to advance the tools and methodologies used to test 3D integrated circuits (ICs), which promise to help ensure the ongoing development of higher performance, lower power semiconductor chips.Share:    Trends in materials: The smartphone driverTo understand 3-D FinFET doping and high mobility channel material, this talk will review the current doping and Fin/channel mobility enhancement techniques used for 22nm FinFET production by Intel for both high performance logic and SOC devices and the changes they made for their 2nd generation 14nm FinFET.Share:

Business News Semiconductor CEOs urge congress to enact Trade Promotion AuthorityThe SIA board of directors, led by Intel CEO and SIA chairman Brian Krzanich, sent a letter to congressional leaders expressing support for the legislation and urging its swift passage. Share:    Synopsys to acquire software security company CodenomiconSynopsys, Inc. announced it has signed a definitive agreement to acquire Codenomicon.Share:    Samsung Galaxy S6 Edge pricier to build, cheaper to buy than comparable Apple iPhone 6 PlusThe recently released Samsung Galaxy S6 Edge is the most expensive Galaxy S line smartphone yet built, but has a lower retail price than a comparable iPhone 6 Plus, according to a preliminary estimate by IHS and its Technology Mobile Handsets Intelligence Service.Share:    A*STAR's IME and partners to enable low cost packaging technology for system scaling within smart devicesA*STAR's Institute of Microelectronics (IME), together with industry partners, have formed a High-Density Fan-Out Wafer Level Packaging (FOWLP) consortium to extend FOWLP capabilities for applications in devices such as smart phones, tablets, navigation tools and gaming consoles.Share:

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