20150528

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In this issue:
• ITRS 2.0: Heterogeneous integration
• Insights from the Leading Edge: ASE & the Apple watch, ASE / TDK JV; China: the Wild Card
• Safe CMP slurries for future IC materials
• Visualizing formation in BEOL
• Enhanced thermal management solutions for RF power amplifiers
• Co-design of chips, packages and boards
• Two-dimensional semiconductor comes clean
• ASE and TDK announce plans for joint venture agreement
• Microchip Technology to acquire Micrel
• New approaches to small problems
• Silicon Storage Technology, GLOBALFOUNDRIES announce qualification of automotive grade 55nm flash memory tech
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Top News
ITRS 2.0: Heterogeneous integrationInterconnecting transistors and other components in the IC, in the package, on the printed circuit board and at the system and global network level, are where the future limitations in performance, power, latency and cost reside.Share: Facebook Linkedin Twitter
Insights from the Leading Edge: ASE & the Apple watch, ASE / TDK JV; China: the Wild CardRumors are that ASE has won the contract to package the S1 processors for Apple Watch using SiP packaging to reduce overall dimensions achieving the required compactness necessary in the watch.Share: Facebook Linkedin Twitter
Safe CMP slurries for future IC materialsNew chemical-mechanical planarization (CMP) processes for new materials planned to be used in building future IC devices are now in research and development (R&D). (From SemiMD)Share: Facebook Linkedin Twitter
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Tech News
Visualizing formation in BEOLNew tests show in real-time that cracks can run on top of and through metal layers.Share: Facebook Linkedin Twitter
Enhanced thermal management solutions for RF power amplifiersSynthetic diamond heat spreaders and GaN-on-Diamond wafers have emerged as a leading thermal-management technology for RF Power Amplifiers.Share: Facebook Linkedin Twitter
Co-design of chips, packages and boardsA new product from Mentor Graphics called Xpedition Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools.Share: Facebook Linkedin Twitter
Two-dimensional semiconductor comes cleanResearchers at Columbia Engineering, Harvard, Cornell, University of Minnesota, Yonsei University in Korea, Danish Technical University, and the Japanese National Institute of Materials Science have shown that the performance of another 2D material--molybdenum disulfide (MoS2)--can be similarly improved by BN-encapsulation. Share: Facebook Linkedin Twitter
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Business News
ASE and TDK announce plans for joint venture agreementDriving towards market leadership in setting the industry standard for semiconductor miniaturization in portable and wearable consumer devices.Share: Facebook Linkedin Twitter
Microchip Technology to acquire MicrelMicrochip Technology Incorporated and Micrel Incorporated announced that Microchip has signed a definitive agreement to acquire Micrel.Share: Facebook Linkedin Twitter
New approaches to small problemsThe market expectations of modern electronics technology are changing the landscape in terms of performance and, in particular, power consumption, and new innovations are putting unprecedented demands on semiconductor devices.Share: Facebook Linkedin Twitter
Silicon Storage Technology, GLOBALFOUNDRIES announce qualification of automotive grade 55nm flash memory techMicrochip Technology Inc., through its Silicon Storage Technology subsidiary, and GLOBALFOUNDRIES announced the full qualification and availability of a 55nm embedded SuperFlash non-volatile memory on GLOBALFOUNDRIES' 55nm Low Power Extended (LPx)/ RF enabled platform.Share: Facebook Linkedin Twitter
Web Editor
Shannon Davis
603-547-5309
sdavis@extensionmedia.com


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International Multidisciplinary Research Conference
 
Theme: "Innovative Trends in Commerce, Management, Vocational,
Social, Environmental, Engineering and Technology"
 
Jointly Organised By
Commonwealth Vocational University (CVU)
International Association of Academicians and Researchers (INAAR)
 
Date: 30th June, 2015                                                                              Venue: MCCIA, Tilak Road, Pune
Call for Papers
Journal Publication Date: 30thjune, 2015
Paper Submission: 30th May, 2015

 
Original Research Paper (MS Word Single Column only) are invited for review and subsequent publishing on various areas related to the theme and sub themes comprising not more than five pagesincluding diagrams, graphs, tables, figures etc on conference.pune@gmail.com only. Authors will receive the copy of journal at their postal address.
 
The papers received after review and acceptance shall be published either in:
1.       ISSN       2249 – 7455         International Journal of Advances in Management, Technology & Engineering Sciences
2.             ISSN       2249 – 7463         International Journal of Business, Management & Social Sciences
3.             ISSN       2277 – 9302         International Journal of Multidisciplinary Research
4.            ISSN       2277 – 9310         International Research Journal of Commerce, Business and Social Sciences
5.             ISSN       2277 – 9329         International Research Journal of Humanities and Environmental Issues
6.             ISSN       2348 – 1625         International Journal of Engineering and Technological Advances
7.             ISSN       2348 – 1633         International Journal of Developments in Trade, Commerce and Business
8.             ISSN       2348 – 1641         International Journal of Management Contemplation’s
9.             ISSN       2348 – 165X        International Journal of Economics, Law and Social Sciences
 
Themes: Multiple themes are covered related to Commerce, Management, Technology, IT, Computer Applications, Engineering, Entrepreneurship, Economics, Humanities, Law, Social Sciences, Climate Change, Environmental Issues and Challenges, Muslim Studies and Peace Building, Sustainable Development, Sport Science, Health Science, Home Science, Social Science, History, politics, Sociology, Languages, Literature, Linguistics.
However the above mentioned themes are indicative. The researchers can submit the paper relevant to the themes or their area of specialisation.
 
Process: Papers as and when received shall be sent for review. Acceptance of paper will be notified only after the comments from the reviewer are received. Thereafter the author shall send the prescribed fees along with the copyright form. The printing of journals shall take place as per the given dates. Thereafter the author/s shall receive the hard copy of journal along with the certificate by courier or can be collected from our office.
 
Important Dates: (Last Dates)
Full Paper Submission
Notification of Acceptance
Registration
30th May, 2015
2nd June, 2015
7th June, 2015
 
 The papers in each journal shall be published purely on merit and first come basis.
1.       Registration fee per author per paper (Indian Authors) as mentioned in acceptance letter should be paid through Demand Draft drawn in favour of “INAAR” payable at Pune.
2.       Payments can also be made through Bank Transfer. The details of Bank Transfer will be given along with the acceptance of paper. However it shall be the responsibility of the author to send the details of the transaction after making online payment / Bank Transfer. Failing which the paper may not be forwarded for printing.
3.       Send your Demand Draft to International Association of Academicians and Researchers (INAAR)12-B, PREMDEEP, 3rd Floor Sind Hindu Society, Opposite Manikchand Malabar Hill, Lullanagar, PUNE – 411040. MS, INDIA.
 
For queries sms on +919881431238
 
International Association of Academicians and Researchers (INAAR)
H.O.: 12-B, PREMDEEP, 3rd Floor Sind Hindu Society, Opposite Manikchand Malabar Hill,
Lullanagar, PUNE – 411040. MS, INDIA.
 
Chapters (India): Delhi, Mumbai, Surat, Jaipur, Goa                                                                               
Chapters (International): Thailand, Singapore, Malaysia