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E-mail: editor@ijebr.com

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3rd International Conference on Business Management & Information Systems November 17-20, 2015 Venue: Seminar Hall, Singapore Management University Singapore www.ijacp.org

                    

  

                                                

CONFERENCE PARTNERS
California State University at San Bernardino, CA, USA Department of  Business & Public Administration 
Great Lakes Institute of Management, Chennai, India________________________________________________________________________________________

UPDATE

Our conference colleague Dr. James McKee invites chapter contributions for the book "Enterprise Architecture as a Tool for
Successful Business Planning".

Interested researchers may contact the editors Dr. James McKee and Dr. Gavin Finnie atarchitecture@ihug.com.au

_______________________________________________________________________________

CALL FOR PAPERS AND CASES

CBMIS2015.sg2 invites submissions from researchers and practitioners in the following areas:

-Business Management
-Information Systems

 -Sub-themes

-Digital Marketing in Globalized Markets
-Big Data and Cloud Computing
-Management of Education

The submissions may be research papers, work-in-progress, case studies or experiential insights from
researchers and practitioners.

PUBLICATIONS OPPORTUNITIES
Papers presented at the conference will be published in the Proceedings of the International Conference
on Business Management and IS bearing an ISBN number. The proceedings are scheduled to be
published by Bloomsbury ( www.bloomsbury.com). 

SPECIAL ISSUES OF INTERNATIONAL JOURNALSICBMIS2015.sg2 has reached an understanding with the following journals for publishing selected papers
presented at the conference subject to their editorial policy.

IJKEDM: International Journal of Knowledge Management and Data Mining ( www.inderscience.com/ijkedm),IJIIM: International Journal of Intercultural Information Management
( www.inderscience.com/ijiim)

IJLEG: International Journal of Logistics Economics and Globalization
IJEM: International Journal of Educational Management  (www.emeraldinsight.com )

Important Deadlines

Last date for abstract submission: 30 June, 2015 Click here to submit abstract

Last date for submission of camera-ready paper: 30 September, 2015

Contact

Managing Editor : managing.editor@ijacp.org

Conference URL: www.ijacp.org

IJACP International Journal of Academic Conference Proceedings
7675 Phoenix Dr, Houston TX-77030, USA
E-mail: managing.editor@ijacp.org URL: www.ijacp.org

Home Wafer Processing Lithography Device Architecture Metrology
In this issue: • IBM's silicon photonics technology ready to speed up cloud and Big Data applications • Process Watch: Time is the enemy of profitability • Moore's Law to keep on 28nm • TI strengthens analog marketshare; Skyworks gains from Apple • Random nanowire configurations increase conductivity over heavily ordered configurations • Freescale speeds the creation of sensor applications for a secure IoT • High-performance 3-D microbattery suitable for large-scale on-chip integration • Channeling valleytronics in graphene • SEMICON West 2015 focuses on the most critical issues in semiconductor manufacturing • SRC names former Freescale CTO Ken Hansen as new president and CEO • Intel, eASIC collaborate on customized Intel-based solutions for the cloud • Micron Technology names Ernie Maddock as Chief Financial Officer	Share:
Top stories IBM's silicon photonics technology ready to speed up cloud and Big Data applications IBM announced a significant milestone in the development of silicon photonics technology, which enables silicon chips to use pulses of light instead of electrical signals over wires to move data at rapid speeds and longer distances in future computing systems.  Share:    Process Watch: Time is the enemy of profitability There are three main phases to semiconductor manufacturing: research and development (R&D), ramp, and high volume manufacturing (HVM). All of them are expensive and time is a critical element in all three phases. Share:    Moore's Law to keep on 28nm Scaling is now bifurcating - some scaling on with 28/22nm, while other push below 14nm. Share:    TI strengthens analog marketshare; Skyworks gains from Apple Top 10 suppliers accounted for 57% of analog sales in 2014; 9 of 10 top suppliers with analog sales greater than $1.0 billion. Share:
Tech News Random nanowire configurations increase conductivity over heavily ordered configurations Researchers at Lehigh University have identified for the first time that a performance gain in the electrical conductivity of random metal nanowire networks can be achieved by slightly restricting nanowire orientation. Share:    Freescale speeds the creation of sensor applications for a secure IoT Freescale Semiconductor introduced its Intelligent Sensing Framework (ISF) 2.1, which now includes integration with Freescale's Processor Expert tool to help create, configure, and generate embedded sensor-based applications for Freescale microcontrollers (MCUs). Share:    High-performance 3-D microbattery suitable for large-scale on-chip integration By combining 3D holographic lithography and 2D photolithography, researchers from the University of Illinois at Urbana-Champaign have demonstrated a high-performance 3D microbattery suitable for large-scale on-chip integration with microelectronic devices. Share:    Channeling valleytronics in graphene To the list of potential applications of graphene - a two-dimensional semiconductor of pure carbon that is stronger and much faster than silicon - we can now add valleytronics. Share:
Business News SEMICON West 2015 focuses on the most critical issues in semiconductor manufacturing SEMI announced the SEMICON West 2015 technical and business program agenda tackling the most important issues facing the future of semiconductor manufacturing. Share:    SRC names former Freescale CTO Ken Hansen as new president and CEO Semiconductor Research Corporation (SRC) announced that Ken Hansen has been appointed SRC's new President and Chief Executive Officer (CEO), effective June 1.  Share:    Intel, eASIC collaborate on customized Intel-based solutions for the cloud Intel Corporation announced plans to develop integrated products with eASIC Corporation that combine processing performance and customizable hardware to meet the increasing demand for custom compute solutions for data centers and the "cloud." Share:    Micron Technology names Ernie Maddock as Chief Financial Officer Micron Technology, Inc. announced that the company has appointed Ernie Maddock as Chief Financial Officer and Vice President, Finance, effective June 1, 2015. Share:
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