20141224

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In this issue:
• What's next for MEMS?
• IoT's divergent needs will drive different types of technologies
• The most expensive defect
• 3D TSV begins
• Imec presents ultralow power RFID transponder chip in thin-film transistor technology on plastic at IEDM 2014
• From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling
• Imec demonstrates broadband graphene optical modulator on silicon
• Lead islands in a sea of graphene magnetize the material of the future
• Book-to-bill climbs above parity in November
• Synopsys and imec expand TCAD collaboration to 5nm and beyond
• Veeco completes acquisition of Solid State Equipment Holdings LLC
• Silicon Image launches new subsidiary to focus on Internet of Everything services
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Top News
What's next for MEMS? The proliferation of sensors into high volume consumer markets, and into the emerging Internet of Things, is driving the MEMS market to maturity, with a developed ecosystem to ease use and grow applications. But it is also bringing plenty of demands for new technologies, and changes in how companies will compete.
IoT's divergent needs will drive different types of technologiesGiven the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges - both economic and technical. 
The most expensive defectDefects that aren't detected inline cost fabs the most. 
3D TSV begins"Engineering samples have already started to ship and preparation is on-going for entering volume manufacturing," announces Yole.
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Tech News
Imec presents ultralow power RFID transponder chip in thin-film transistor technology on plastic at IEDM 2014At this week's IEDM 2014, held in San Francisco, California, nanoelectronics research center imec demonstrated an ultra-low power RFID transponder chip.
From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion millingCross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling.
Imec demonstrates broadband graphene optical modulator on siliconAt this week's IEEE International Electron Devices Meeting (IEDM 2014), nanoelectronics research center imec and its associated lab at Ghent University have demonstrated the industry's first integrated graphene optical electro-absorption modulator (EAM) capable of 10Gb/s modulation speed. 
Lead islands in a sea of graphene magnetize the material of the futureResearchers in Spain have discovered that if lead atoms are intercalated on a graphene sheet, a powerful magnetic field is generated by the interaction of the electrons' spin with their orbital movement.
Business News
Book-to-bill climbs above parity in NovemberNorth America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published by SEMI.
Synopsys and imec expand TCAD collaboration to 5nm and beyondSynopsys, Inc. announced the expansion of its collaboration with imec (nanoelectronics research center imec) to nanowire and other devices (FinFETs, Tunnel-FETs) targeting the 5-nanometer (nm) technology node and beyond. 
Veeco completes acquisition of Solid State Equipment Holdings LLCVeeco Instruments Inc. announced that it has acquired privately held Solid State Equipment Holdings LLC, based in Horsham, Pennsylvania. 
Silicon Image launches new subsidiary to focus on Internet of Everything servicesSilicon Image, a provider of multimedia connectivity solutions and services, announced that Qualcomm Technologies, Inc. has made a $7 million strategic investment in Silicon Image's new subsidiary, Qterics, for a 7% ownership interest.
Web Editor
Shannon Davis
603-547-5309
sdavis@extensionmedia.com

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