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Get the in-depth analysis you need in this issue In this month’s issue you'll find....  Changes and challenges abound in multi-patterning lithography By Jeff Dorsch, contributing editor Experts in the fields of electronic design automation and lithography address the issues associated with the technology. Supplier Hub answers the needs of a changing semiconductor industry By Luc Van den hove, imec, Leuven, Belgium  The industry may indeed stand at an inflection point, but the future is bright. Innovation cannot be stifled. And collaboration remains the consensus of an industry focused on the next new thing. Advanced analytics for yield improvement and zero defect in semiconductors By Anil Gandhi, Ph. D. and Joy Gandhi, Qualicent Analytics, Inc., Santa Clara, CA  Machine learning based advanced analytics for anomaly detection offers powerful techniques that can be used to achieve breakthroughs in yield and field defect rates. Imaging tomorrow’s components, acoustically By Tom Adams, Sonoscan, Inc., Elk Grove Village, IL  Packages are changing. Acoustic methods provide a way to image and analyze them. Consider packaging requirements at the beginning, not the end, of the design cycle By John T. Mackay, Semi-Pac, Inc., Sunnyvale, CA  Consider these eight issues where the packaging team should be closely involved with the circuit design team. Techniques for Simplifying Pulsed Measurements: Part 2 By David Wyban, Keithley Instruments, a Tektronix Company, Solon, Ohio  Common pulsed measurement challenges are defined. Web tension control in roll-to-roll web processing  By Bipin Sen, Bosch Rexroth, Hoffman Estates, IL  Achieving precise registration accuracy is a factor of two related variables: web tension and transport velocity. Regards, Pete Singer Editor-in-Chief www.solid-state.com