NXP-Freescale merger

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In this issue: • NXP-Freescale merger to result in world's eighth largest chip maker • Cypress and Spansion complete $5 Billion merger • 11 IC product categories to exceed total IC market growth in 2015 • Strong fab equipment spending expected in 2015; Slowing but positive 2016 • Insights from the Leading Edge: Package shrinkage continues with ASE FOCLP • Microsemi introduces second generation 64GB solid state drive • CEA-Leti announces launch of Silicon Impulse IC design competence center • IRT Nanoelec and CMP team up to offer world's first service for post-process 3D technologies on multi-project-wafer • MACOM announces new 650 W GaN on SiC HEMT pulsed power transistor • Small powerful systems give rise to medical semiconductor sales • Optoelectronics, sensors/actuators, and discretes growth accelerates • NXP and GlobalFoundries announce production of 40nm embedded non-volatile memory technology • North American semiconductor equipment industry posts February 2015 book-to-bill ratio of 1.02	Share:
Top News NXP-Freescale merger to result in world's eighth largest chip maker The recent acquisition of Freescale Semiconductor by NXP Semiconductors would catapult the merged entity into the world's eighth-largest chipmaker, positioning the newly minted giant for an even more formidable presence in key industrial sectors, according to IHS.Share:    Cypress and Spansion complete $5 Billion mergerCypress Semiconductor Corp. and Spansion, Inc. announced that they have closed the merger of the two companies in an all-stock, tax-free transaction valued at approximately $5 billion. Share:    11 IC product categories to exceed total IC market growth in 2015IC Insights' March Update to the 2015 McClean Report (being released later this month) refreshes the forecasts for 33 major IC product categories through 2019.Share:    Strong fab equipment spending expected in 2015; Slowing but positive 2016 SEMI announced an update of the SEMI World Fab Forecast report which updates outlooks for 2015 and 2016. Share:
Tech News Insights from the Leading Edge: Package shrinkage continues with ASE FOCLPThe IMAPS Device Packaging Conference in Ft McDowell, AZ is an annual meeting where we have grown to expect major new technical introductions from the OSAT and materials community.Share:    Microsemi introduces second generation 64GB solid state driveMicrosemi Corporation introduced its second generation highly secure 64 gigabyte (GB) solid state drive (SSD).Share:    CEA-Leti announces launch of Silicon Impulse IC design competence centerCEA-Leti announced the launch of its Silicon Impulse IC design competence center, a comprehensive IC technology platform offering IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles. Share:    IRT Nanoelec and CMP team up to offer world's first service for post-process 3D technologies on multi-project-waferIRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and CMP, which provides prototyping and low-volume production of ICs and MEMS, are launching a platform for multi-project-wafer, post-process 3D integration (3D-MPW). Share:    MACOM announces new 650 W GaN on SiC HEMT pulsed power transistorM/A-COM Technology Solutions Inc. announced a 650 W gallium nitride (GaN) on silicon carbide (SiC) HEMT pulsed power transistor for L-band pulsed avionics applications.Share:
Business News Small powerful systems give rise to medical semiconductor salesMarket for medical semiconductors seen rising to $8.2 billion in 2018.Share:    Optoelectronics, sensors/actuators, and discretes growth acceleratesAfter two years of sluggishness, O-S-D sales strengthen with an improving economy and a boost from new applications, says new 2015 report.Share:    NXP and GlobalFoundries announce production of 40nm embedded non-volatile memory technologyGLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, and NXP Semiconductor N.V, a semiconductor company for secure connection solutions, announced that they have jointly developed a next-generation embedded non-volatile memory.Share:    North American semiconductor equipment industry posts February 2015 book-to-bill ratio of 1.02A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.Share:
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