sstaehle@lrp.com

May 7, 2015

Welcome to our weekly look at Web-exclusive columns that appear on www.HREOnline.com, the Web site of Human Resource Executive® magazine. Benefits By Carol Harnett In Search of an Elegant Well-Being Strategy HR and employee-benefit leaders want to move beyond debates about physical wellness to discussions around a host of underlying issues. Read the column. Read past columns by Carol Harnett You're invited to nominate top HR leaders for our 2015 HR Executive of the Year competition. The deadline for submissions is May 11, 2015. HREOnline's Legal Clinic If you are an HR professional and have a general question relating to human resource issues that you would like answered online, please submit it here. Subscribe to Human Resource Executive®Magazine Subscribe to HREOnline™ newsletters  RSS feed from HREOnline™ Human Resource Executive® Webinars Human Resource Executive Conferences™ Human Resource Executive®'s HR Technology® Conference & Exposition, Oct. 18-21, 2015

Contacts: Sales information: Sharon Staehle - sstaehle@lrp.com Editorial: Michael J. O’Brien - mobrien@lrp.com Subscribe: Click here to subscribe to Human Resource Executive® so you can continue to read about issues that matter to you: Subjects like Benefits, Training, Technology, Staffing, Recruitment and Screening to name a few. © Copyright 2015 LRP Publications. All rights reserved. Human Resource Executive® 747 Dresher Road Suite 500 Horsham, PA 19044 Trends in Materials: The Smartphone Driver ON-DEMAND WEBCAST: Today the semiconductor industry is driven by smartphone with 1.24B units sold in 2014 out numbering tablets & PC sales. The expected increase in smartphone application processor (AP) demand in 2015 (Apple A9, Samsung Exynos 7 and Qualcomm Snapdragon) is driving the rapid ramp to 14/16nm 3-D FinFET at foundries, 3-D memory devices such as 128Gb Flash with 32-layers and 3-D stacked chips for package area saving. Intel was first to production with 3-D bulk-FinFET devices at the 22nm technology node in 2012 and reported their SOC for Chinese low-end smartphones. Intel’s 2nd generation bulk-FinFET devices at 14nm node was introduced in Aug 2014 and their SOC to follow. Apple uses Sony’s 8M pixel 3-D stacked backside CMOS image sensor for rear-facing cell phone camera and Samsung offers two versions of the 128Gb Flash memory either 16nm 2-D NAND or 32nm 3-D NAND with 32-layers. Samsung Galaxy S6 will also use 3-D ePoP (embedded package on package) which stacks AP+DRAM+Flash+MMC saving 40% area and use 20M pixel rear-facing cell phone camera and 8M pixel RWB image sensor for front-facing camera. Speakers: John O. Borlan, President, JOB Technologies  View this Webcast ASIC Design Made Cost Effective with Low Cost Tools and Masks WHITE PAPER:  For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. Download the White Paper Last Call to Register for The ConFab HERE ARE JUST A FEW OF THE TOPICS THAT WILL BE PRESENTED AT THE CONFAB 2015: Monetizing the Internet of Things — Renesas Electronics America Inc. The ITRS: Past, Present and Future — ITRS Industrial 450mm Transition: Status and Outlook — G450C & TSMC  Design Eco-system: A Critical Enabler for Semiconductor Growth — GLOBALFOUNDRIES IoT: Driving Technology Trends on System Scaling & Semi Manufacturing Effectiveness —imec Yield, Reliability and Cost Challenges at 16nm and Beyond — KLA-Tencor Reducing the Operating Costs of Existing Sub-Fab Equipment — Edwards The Outlook for 2015 and Beyond — IC Insights What Does Moore Look Like at 28nm and Below? — Samsung Advanced Packaging and 3D Integration — ASE, Cisco, AMD, IBM, Intel Critical Challenges in Materials Supply to Advanced Semiconductor Manufacturing Fabs —Linde VIEW the complete conference program. The ConFab May 19-22, 2015 Encore at the Wynn, Las Vegas Presented by: Solid State Technology View more Details Additional Resources UPCOMING WEBCASTS MEMS Interconnects Understanding Defects Interested in presenting in a future Solid State Technology webcast? We are currently looking for speakers for several upcoming webcasts. Click HERE to contact an editor for a list of upcoming topics and more details. View More Webcasts SUBSCRIBE | ADVERTISE | TERMS AND CONDITIONS | UNSUBSCRIBE All materials on this site Copyright © 2014 Extension Media LLC. All rights reserved. 1786 18th Street San Francisco, CA 94107 USA 415.255.0390