| Get the in-depth analysis you need in this issue
In this month’s issue you'll find.... | | How to verify incident implant angles on medium current implants By Bobby Isaacs and Anya Cornell, Texas Instruments, Dallas, Tex. Results can depend on the properties of the wafers used, the conditions of the implant, the conditions of the anneal process, and even the measurement technique. 450mm higher gas flows pose opportunities By Dr. Mike Czerniak, Andrew Chambers and Adrienne Pierce, Edwards, Clevedon, UK. The move to 4500mm wafers will likely result in gas flow increased on process vacuum and abatement equipment. Three-dimensional atomic force microscopy By Keibock Lee, Park Systems, Santa Clara, CA. 3D atomic force microscopes can measure critical dimensions, line edge roughness and sidewall roughness in a way that is highly accurate, non-destructive and cost-effective. Managing legacy fabs and the role of secondary equipment By Julian Gates and Tim Johnson, AG Semiconductor Services; and DARRELL McDANIEL, NSTAR Global Services, M+W Group. The choice between buying new systems from OEMs or fully capable refurbished gear from qualified used equipment vendors is examined. Will 2014 be the Next Golden Year? By Christian Gregor Dieseldorff, SEMI Industry Research and Statistics Group, San Jose, CA. Some unexpected underdogs spur spending spree. Regards,
Pete Singer Editor-in-Chief www.solid-state.com |
|