20150613

Connect with Aviation Week

INTERNATIONAL 

MULTIDISCIPLINARY MULTILINGUAL E-JOURNAL

                                                       ISSN   2349-3909

Dear Sir/Ma’am,

Greetings from Future Thought!

Future Thought gives you an opportunity to submit articles, research papers, abstract of doctoral dissertations, book reviews, case studies, short communications & bibliographies for its multidisciplinary, multilingual 
international 
e-journal
, open access quarterly journal of 
Social Sciences, Linguistics, Literature, Humanities, Applied Physics, Architecture, Artificial Intelligence, Astronomy, Biological Sciences, Botany, Chemistry, Civil Engineering, Computer Sciences, Computer Engineering, Computing Technology, Design, Earth Sciences, Ecology,Agriculture, Electrical Engineering, Electronics, Energy, Engineering Sciences, Environmental Sciences, Fisheries, Forestry, Health Sciences, Life sciences, Logic, Marine Sciences, Materials Engineering, Mathematics, Mechanical Engineering, Mechatronics, Medical Sciences, Nanotechnology, Nuclear Physics, Optics, Physical Geography, Physics, Software Engineering, Space Sciences, Statistics, Transportation Studies, Zoology, Anthropology, Applied Linguistic, Cultural studies, Interdisciplinary Social Sciences,Music,Life sciences, Visual and Performing Arts, Politics, Commerce, Economics and Management
, Law being brought out for offering efficacious propagation of the latest reckoning and research pertaining to the various multidisciplinary aspects relevant for practitioners as well as for academicians & researchers working around the globe.

For more details visit: www.futurethoughtjournal.org

The author(s) may submit the soft copy of manuscript in MS Word format after preparing the same as per guidelines for authors at: publication@futurethoughtjournal.org

In case of any query, please feel free to contact.
-- 

Editor
Future Thought

Dear Sir/Madam,

INTERCONTINENTAL MANAGEMENT RESEARCH CONSORTIUM

INTERNATIONAL JOURNAL WITH  IMPACT FACTOR & INDEXING

CALL FOR RESEARCH ARTICLES 
VOL-3, ISSUE-6
JUNE, 2015

INTERCONTINENTAL JOURNAL OF HUMAN RESOURCE RESEARCH REVIEW

IMPACT FACTOR=0.875 
ISSN: 2320-9704 (ONLINE)
ISSN: 2347 -1662 (PRINT)

INTERCONTINENTAL JOURNAL OF MARKETING RESEARCH REVIEW
IMPACT FACTOR=0.882
ISSN: 2321-0346 (ONLINE)
ISSN: 2347 -1670 (PRINT)

         INTERCONTINENTAL JOURNAL OF                       FINANCE RESEARCH REVIEW                     IMPACT FACTOR=0.720
ISSN : 2321-0354 (ONLINE)
ISSN: 2347 -1654 (PRINT)

 SUBMISSION GUIDELINES
Research paper prepared in English in MS word template not exceeding 10-12 single spaced typed pages should be submitted electronically as attachment to the following e-mailid:
PLEASE UPLOAD YOUR ARTICLES @  www.icmrr.org


ALL MAILS TO BE SENT TO 

INDEXING

ULRICHS PERIODICALS DIRECTORY, USA

 PROQUEST, U.S.A.

ELECTRONIC JOURNAL LIBRARY, UNIVERSITY LIBRARY OF REGENSBURG, GERMANY

 GOOGLE SCHOLAR.

 SUBMISION DEADLINE 

__________________________
LAST DATE: 

23- JUNE-2015

PUBLICATION DATE:

25- JUNE-2015
PLEASE VIEW OUR WEBSITE TO KNOW ABOUT GUIDELINES FOR SUBMISSION.

WEBSITE 

Regards



In this issue:
• Leti demos new process to fabricate high-brightness micro-LED arrays for next-gen head-mounted and head-up displays
• Fab equipment growth continues into 2015
• Fujifilm and imec demonstrate full-color OLEDs with photoresist technology for organic semiconductors
• 3D NAND, MRAM, RRAM: Emerging opportunities and challenges for the changing memory market
• Move over, 16nm - here comes 10nm chips
• 50 Years of Moore's Law
• Random nanowire configurations increase conductivity over heavily ordered configurations
• SEMI reports first quarter 2015 worldwide semiconductor equipment figures; billings $9.52B
• North America: A critical player in the advanced semiconductor market
• Tablet shipments lose momentum; Total PC unit forecast downgraded
• Insights from the Leading Edge: Simply obeying the laws of economics
• SEMI April 2015 book-to-bill report shows continued improvements in bookings and billings
Share: Facebook Linkedin Twitter

 
 
 
 
 
Top News
Leti demos new process to fabricate high-brightness micro-LED arrays for next-gen head-mounted and head-up displaysCEA-Leti announced that it has demonstrated a path to fabricating high-density micro-LED arrays for the next generation of wearable and nomadic systems in a process that is scalable to the IC manufacturing process.Share: Facebook Linkedin Twitter
Fab equipment growth continues into 2015Fab equipment spending is forecast to depart from the typical historic trend over the past 15 years of two years of spending growth followed by one of decline. For the first time, equipment spending could grow every year for three years in a row: 2014, 2015, and 2016.Share: Facebook Linkedin Twitter
Fujifilm and imec demonstrate full-color OLEDs with photoresist technology for organic semiconductorsFUJIFILM Corporation and nano-electronics research institute, imec have demonstrated full-color organic light-emitting diodes (OLED) by using their jointly-developed photoresist technology for organic semiconductors.Share: Facebook Linkedin Twitter
3D NAND, MRAM, RRAM: Emerging opportunities and challenges for the changing memory marketEver growing volumes of data to be stored and accessed, and advancing process technologies for sophisticated control of deposition and etch in complex stacks of new materials, are creating a window of opportunity for an emerging variety of next-generation non-volatile memory technologies.Share: Facebook Linkedin Twitter
Tech News
Move over, 16nm - here comes 10nm chipsTaiwan Semiconductor Manufacturing wants you to know that they're ready, willing, and able to help you design chips with 10-nanometer features.Share: Facebook Linkedin Twitter
50 Years of Moore's LawFor 50 years, Moore's Law has served as a guide for technologists everywhere in the world, setting the pace for the semiconductor industry's innovation cycle.Share: Facebook Linkedin Twitter
Random nanowire configurations increase conductivity over heavily ordered configurationsResearchers at Lehigh University have identified for the first time that a performance gain in the electrical conductivity of random metal nanowire networks can be achieved by slightly restricting nanowire orientation.Share: Facebook Linkedin Twitter
Business News
SEMI reports first quarter 2015 worldwide semiconductor equipment figures; billings $9.52BSEMI reported that worldwide semiconductor manufacturing equipment billings reached US$9.52 billion in the first quarter of 2015. Share: Facebook Linkedin Twitter
North America: A critical player in the advanced semiconductor marketAs the fabless business model has transformed the semiconductor manufacturing landscape, Taiwan and South Korea have undeniably grown into key semiconductor producing regions. However, it should be noted that North America is home to Intel, Texas Instruments, Micron, GLOBALFOUNDRIES, Freescale, Fairchild, Microchip, ON Semiconductor, significant operations of Samsung, and other manufacturers.Share: Facebook Linkedin Twitter
Tablet shipments lose momentum; Total PC unit forecast downgradedIC Insights has downgraded its forecast for the overall personal computing market, including much lower growth in tablets and continued weakness in standard PCs.Share: Facebook Linkedin Twitter
Insights from the Leading Edge: Simply obeying the laws of economicsThere are laws and then there are laws. "Moore's Law" to me is more of an observation.Share: Facebook Linkedin Twitter
SEMI April 2015 book-to-bill report shows continued improvements in bookings and billingsA book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.Share: Facebook Linkedin Twitter
Web Editor
Shannon Davis
603-547-5309
sdavis@extensionmedia.com

Subscription InformationSST invites you to forward this newsletter to colleagues or associates who might be interested in our weekly news summaries.

You may also contact us to by clicking here or you can write to us at:
Extension Media
1786 18th Street
San Francisco, CA 94107
USA


Aviation Week eBulletin
June 2015
Production-Ready Solutions for Aerospace
 

White Papers

Xycomp® Aerospace Brackets

SPONSORED
Xycomp DLF high-performance thermoplastic composite brackets are 30-60% lighter than competing metallic components. This makes them an excellent, versatile replacement option for metal materials....

Articles

Xycomp® 5101 High-Performance Thermoplastic Composite Landing Gear Space Rings

SPONSORED
Aircraft landing gear components are subjected to extreme loads from gear deployment, aerodynamic forces, landing and taxiing...

Xycomp® 5475 High-Performance Thermoplastic Composite Assembly

SPONSORED
To protect critical electronic components in various applications, manufacturers install enclosure boxes for protection from environmental and electrical elements...

Xycomp® DLF® Thermoplastic Composites

SPONSORED
The Performance of Metal at a Fraction of the Weight...
 
Advertisement
GE Aviation TruEngine banner

Videos

Videos by Greene, Tweed


Innovation

Vision
Changing the Game on Engine Diagnostics
Capabilities
Driving Customer Outcomes With New Analytics
Xycomp®
 

To learn more about AviationWeek.com Special Topic pages and other custom digital sponsorship opportunities, contact your account manager, or:Jason Washburn • +1 (216) 931-9161 • jason.washburn@penton.com

Connect with Aviation Week   Twitter    Facebook    LinkedIn    YouTube

       View Here
Get the in-depth analysis you need in this issue

In this month’s issue you'll find....
Reduced defectivity and cost-of-ownership copper CMP cleans 
By Christopher Eric Brannon, Texas Instruments, Dallas, TX
A new, low pH, BTA free, noble-bond chemistry produced equivalent yield at substantially lower costs.

A novel characterization technique unveils the 3D structure of conductive filaments in resistive switching memories
By Umberto Celano, imec, Leuven, Belgium
Imec researchers have developed a novel technique – termed conductive atomic force microscopy tomography (or scalpel C-AFM) – that enables a three-dimensional characterization of emerging logic and memory devices.

The impact of consumer demand for cutting-edge display technology on the gases market
By Eddie Lee, Linde Electronics, Hsin Chu, Taiwan
How gases are used in the manufacture of displays is being impacted by new technologies, consumer demand, and the burgeoning China market.

Going organic: The cost-down route to foldable display manufacture
By Dr. Michael Cowin, SmartKem Ltd., St Asaph, Wales.
Organic semiconductors now offers the performance, cost and route to adoption, for foldable displays, from ultra-thin, conformal, wearables to truly foldable smartphones and tablets.

Drive profitability through better forecasting
By Jitesh Shah, Integrated Device Technology, San Jose, CA 
Different forecasting algorithms are highlighted and a framework is provided on how best to estimate product demand using a combination of qualitative and quantitative approaches.

How emerging IoT impacts the semiconductor sector
By Paula Doe, SEMI, San Jose, CA
At Semicon West in July, a big focus will be on how the Internet of Things explosion could potentially impact the semiconductor industry.

Regards,

Pete Singer
Editor-in-Chief
www.solid-state.com