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In this issue: • Insights from the Leading Edge: Semi 3D Summit - Grenoble: Oerlikon, ST Micro, Qualcomm • Applied's merger with TEL: Still a work in progress • Processing of graphene on 300mm Si wafers in a state-of-the-art CMOS fabrication facility • Applied Materials unveils breakthrough e-beam metrology tool for finFET transistors and 3D NAND devices • Cymer announces shipment of its first XLR 700ix DUV light source and introduces DynaPulse • Thermal performance of 3DICs • Improving the reliability of dry vacuum pumps in high-k ALD processes • Fan-Out Wafer Level Packaging: With a $200M market in 2015, Yole is expecting 30% CAGR in the coming years • January 2015 book-to-bill supports positive outlook for semiconductor equipment industry • Micron appoints Robert Peglar as Vice President of Advanced Storage Solutions • Mentor Graphics announces call for entries for Don Miller Award for Thermo-Fluid Design Excellence	Share:
Top News Insights from the Leading Edge: Semi 3D Summit - Grenoble: Oerlikon, ST Micro, QualcommIn the next two weeks, we'll take a look at some of the more interesting presentations from the SEMI 3DIC Summit in Grenoble last month.Share:    Applied's merger with TEL: Still a work in progressApplied Materials on Wednesday reported that its proposed merger with Tokyo Electron Ltd. (TEL) is still under way, without giving a deadline or expected date of conclusion.Share:    Processing of graphene on 300mm Si wafers in a state-of-the-art CMOS fabrication facilityThe building blocks are described that can be used to fabricate other novel device architectures that can take advantage of the unique properties of graphene or other interesting single-layer (i.e., 2D) materials.Share:
Tech News Applied Materials unveils breakthrough e-beam metrology tool for finFET transistors and 3D NAND devicesAt the SPIE Advanced Lithography conference in San Jose, Calif., Applied Materials, Inc., announced the industry's first in-line 3D CD SEM metrology tool for solving the challenges of measuring the high aspect ratio and complex features of 3D NAND and FinFET devices. Share:    Cymer announces shipment of its first XLR 700ix DUV light source and introduces DynaPulseCymer, an ASML company, a developer of lithography light sources used by chipmakers to pattern advanced semiconductor chips, today announced the shipment of its first XLR 700ix light source. Share:    Thermal performance of 3DICs3DICs are assumed to suffer from stronger thermal issues when compared to equivalent implementations in traditional single-die integration technologies. Share:    Improving the reliability of dry vacuum pumps in high-k ALD processesDesign features that contributed most to the improved performance include increased rotational speed, integrated rotor sleeves, and increased purge injection temperature.Share:
Business News Fan-Out Wafer Level Packaging: With a $200M market in 2015, Yole is expecting 30% CAGR in the coming years"Fan-Out Wafer Level Packaging (FOWLP) is already in high-volume," announced Yole Developpement in its new report, Fan-Out and Embedded Die: Technologies & Market. According to Yole’s analysts, FOWLP market reaches almost $200M in 2015. Share:    January 2015 book-to-bill supports positive outlook for semiconductor equipment industryA book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.Share:    Micron appoints Robert Peglar as Vice President of Advanced Storage SolutionsMicron Technology, Inc. announced that Robert Peglar has been named as vice president of Advanced Storage Solutions.Share:    Mentor Graphics announces call for entries for Don Miller Award for Thermo-Fluid Design ExcellenceMentor Graphics Corporation announced the call-for-entries for its first annual Don Miller Award for Excellence in System Level Thermo-Fluid Design.Share:
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