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In this issue: • 5nm node needs EUV for economics • 2015 outlook: Tech trends and drivers • Exponentially rising costs will bring changes • Underdog DRAM • Changes and challenges abound in multi-patterning lithography • New method allows for greater variation in band gap tunability • New pathway to valleytronics • Researchers at Penn, UC Berkeley and Illinois use oxides to flip graphene conductivity • Yole's Beica examines Internet of Things at RTI 3D ASIP • EUV, Internet of Things, 3D integration among hot topics at SPIE Advanced Lithography • Gov. Baker announces $4M grant to UMass Lowell to fuel emerging printed electronics cluster • 2014 was bumper year for automotive semiconductors • GIGAPHOTON honored with 2015 "Toshiba Partnership Award" • New Soitec eSI90 RF-SOI wafer improves RF performance of high-end smart phone components	Share:
Top stories 5nm node needs EUV for economicsAt IEDM 2014 last month in San Francisco, Applied Materials sponsored an evening panel discussion on the theme of "How do we continue past 7nm?" (From SemiMD)Share:    2015 outlook: Tech trends and driversLeading industry experts provide their perspectives on what to expect in 2015. 3D devices and 3D integration, rising process complexity and "big data" are among the hot topics.Share:    Exponentially rising costs will bring changesScott McGregor, President and CEO of Broadcom, sees some major changes for the semiconductor industry moving forward, brought about by rising design and manufacturing costs.Share:    Underdog DRAMDRAM shifts out of a slump, but sector still faces obstacles. Share:
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Tech News Changes and challenges abound in multi-patterning lithographyMulti-patterning lithography is a fact of life for many chipmakers. Experts in the fields of electronic design automation and lithography address the issues associated with the technology (From SemiMD)Share:    New method allows for greater variation in band gap tunabilityIf you can't find the ideal material, then design a new one.Share:    New pathway to valleytronicsA potential avenue to quantum computing currently generating quite the buzz in the high-tech industry is "valleytronics," in which information is coded based on the wavelike motion of electrons moving through certain two-dimensional (2D) semiconductors.Share:    Researchers at Penn, UC Berkeley and Illinois use oxides to flip graphene conductivityGraphene, a one-atom thick lattice of carbon atoms, is often touted as a revolutionary material that will take the place of silicon at the heart of electronics. The unmatched speed at which it can move electrons, plus its essentially two-dimensional form factor, make it an attractive alternative, but several hurdles to its adoption remain.Share:    Yole's Beica examines Internet of Things at RTI 3D ASIPClosing our look at presentations from the RTI ASIP Conference, let's check out what Rozalia Beica had to say about the latest tech buzz word "the Internet of Things."Share:

Business News EUV, Internet of Things, 3D integration among hot topics at SPIE Advanced LithographyExtreme ultraviolet lithography (EUV), 3D integration, and the Internet of Things will be among critical technologies featured at SPIE Advanced Lithography 2015 22 to 26 February in San Jose, California.Share:    Gov. Baker announces $4M grant to UMass Lowell to fuel emerging printed electronics clusterGov. Charlie Baker announced a $4 million dollar grant from the Massachusetts Technology Collaborative to UMass Lowell to support development of a printed and flexible electronics industry cluster, an emerging field that has the potential to become a $76 billion global market in the next decade. Share:    2014 was bumper year for automotive semiconductorsThe automotive semiconductor market did exceptionally well in 2014, according to new analysis from IHS. Share:    GIGAPHOTON honored with 2015 "Toshiba Partnership Award"Gigaphoton Inc., a lithography light source manufacturer, announced that the company has been recognized with a 2015 Partnership Award from Toshiba Semiconductor & Storage Company's Yokkaichi Operations, a world production base of NAND flash memory devices. Share:

Product News New Soitec eSI90 RF-SOI wafer improves RF performance of high-end smart phone componentsSoitec (Euronext) has introduced its eSI90 substrate, the newest high-end wafer in its radio-frequency silicon-on-insulator (RF-SOI) product family. Share:

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