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In this issue: • Chinese chipmaker Tsinghua prepares $23B bid for Micron Technology • EUV: Unlike anything else in the fab • Business is good for vendors of test and inspection/metrology equipment • Controlling measurements of WLP on high mix, high volume manufacturing • New materials require new approaches • Managing hazardous process exhaust in high volume manufacturing • A new sensor from Golden Valley-based CyberOptics will advance digital gadgets • ECAE improves sputtering target performance • ClassOne Technology's Solstice S4 wins Best of West • CH2M Hill: How being green benefits the bottom line • SEMI Standards leaders honored at SEMICON West 2015 • Leti and EVG launch INSPIRE • Tanaka launches semiconductor wafer cup-type ultra-compact plating laboratory equipment • ClassOne develops new Solstice solution • HORIBA Semiconductor introduces the HD-960L monitor for dissolved oxygen • ClassOne introduces new mid-sized electroplater	Share:
Top stories Chinese chipmaker Tsinghua prepares $23B bid for Micron Technology China's state-owned Tsinghua Unigroup Ltd. is preparing a $23 billion bid for chipmaker Micron Technology, in what analysts say would be the biggest Chinese takeover of a U.S. company. Share:    EUV: Unlike anything else in the fab Imagine EUV lithography in high volume production. ASML has been working for years to make it happen. Share:    Business is good for vendors of test and inspection/metrology equipment Semiconductor test equipment and inspection/metrology equipment are unglamorous yet critical segments of the equipment field. Share:    Controlling measurements of WLP on high mix, high volume manufacturing The demand for 4-mask layer Cu-plated wafer-level chip scale packaging (WLCSP) is increasing rapidly, and the current capability for in-line Cu height measurements is not suitable for high volume manufacturing (HVM). Share:
Tech News New materials require new approaches Continued advances in the semiconductor will increasingly be enabled by materials technology, versus the scaling that has been commonplace over the last 50 years as defined by Moore's Law.  Share:    Managing hazardous process exhaust in high volume manufacturing "Let no element on the periodic table go un-used!" That may well be the rallying cry of the semiconductor industry moving forward.  Share:    A new sensor from Golden Valley-based CyberOptics will advance digital gadgets CyberOptics' latest product ultimately will make digital gadgets better, cheaper. Share:    ECAE improves sputtering target performance Because it can achieve extreme deformation, Equal Channel Angular Extrusion (ECAE) can deliver submicron, high strength and uniform microstructures. The resulting improvements in strength allow for monolithic targets with a longer target life of 20-100%. Share:
Business News ClassOne Technology's Solstice S4 wins Best of West The ClassOne Technology Solstice S4 won the Best of West award, presented by Solid State Technology and SEMI.  Share:    CH2M Hill: How being green benefits the bottom line CH2M has seen many changes and trends in the semiconductor industry since the company was involved designing many of the industry's first wafer fabs back in the 1980s. Share:    SEMI Standards leaders honored at SEMICON West 2015 SEMI honored six industry leaders for their outstanding accomplishments in developing Standards for the microelectronics and related industries.  Share:    Leti and EVG launch INSPIRE CEA-Leti and EV Group launched a new program in nano-imprint lithography (NIL) called INSPIRE to demonstrate the benefits of the nano-patterning technology and spread its use for applications beyond semiconductors. Share:
Product News Tanaka launches semiconductor wafer cup-type ultra-compact plating laboratory equipment Tanaka Holdings Co., Ltd. announced that Electroplating Engineers of Japan, Limited has developed and launched the RAD-Plater cup-type ultra-compact plating laboratory equipment for semiconductor wafers, which achieves equivalent films to mass-production machines. Share:    ClassOne develops new Solstice solution  Semiconductor equipment manufacturer ClassOne Technology announced a configuration for optimizing Through Silicon Via (TSV) and Through Wafer Via (TWV) processes on its affordable Solstice electroplating systems.  Share:    HORIBA Semiconductor introduces the HD-960L monitor for dissolved oxygen HORIBA Semiconductor introduced its new HD-960L for sub-parts-per-billion level monitoring of DO in chemicals with a low sample-consumption rate. Share:    ClassOne introduces new mid-sized electroplater Semiconductor equipment manufacturer ClassOne Technology has announced a new addition to its popular Solstice family. Share:
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