| Tech News | IRT Nanoelec partners achieve 3D chip-stacking technology & 3D network-on-chip frameworkIRT Nanoelec, an R&D consortium focused on Information and Communication Technologies (ICT) using micro- and nanoelectronics, and its partners CEA-Leti, STMicroelectronics and Mentor Graphics have realized an innovative 3D chip called "3DNoC" to demonstrate the use of 3D stacking technology in scalable, complex digital systems-on-chip (SoCs).Share:    | | Peregrine Semiconductor introduces first RF SOI 300mm technology platformPeregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the UltraCMOS 11 platform.Share: | | Biodegradable, flexible silicon transistorsWisconsin researchers have developed a new biodegradable silicon transistor based on a material derived from wood, opening the door for green, flexible, low-cost portable electronics in future.Share: | | The peaks and valleys of siliconWhen the new iPhone came out, customers complained that it could be bent -- but what if you could roll up your too big 6 Plus to actually fit in your pocket? That technology might be available sooner than you think, based on the work of USC Viterbi engineers. Share: | | Insights from the Leading Edge: IEEE ECTC part 1 Thermo compression BondingOver the next few weeks of the summer, I will be covering as much of the 65th IEEE ECTC as I can.Share: |
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