20141104

Web Editor

In this issue:
• Imec, Coventor partner to advance CMOS process development
• Mergers, acquisitions reshape the automotive semi supplier landscape
• Gigaphoton achieves 3-hour continuous operation of EUV light source
• Solid State Watch: Oct. 23-30, 2014
• Air-gaps in copper Interconnects for logic
• Intel's 14nm parts are finally here!
• SMIC and Maxscend collaborate on 55nm RF IP platform
• EUV light source developer Adlyte achieves key performance milestone for high-volume manufacturing
• Special UO microscope captures defects in nanotubes
• SEMICON Japan 2014: New venue and new ideas for rebounding industry
• TSI Semiconductors and Silvaco extend collaboration to accelerate launch of 0.25um BCDMOS process
• MegaChips to acquire SiTime for $200M
• Intersil announces appointment of industry executives to board of directors
• Next-generation nanoimprint lithography technology
• VaporSorb filter line protects advanced yield production from Entegris
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Top stories
Imec, Coventor partner to advance CMOS process developmentImec researchers using Coventor's SEMulator3D platform to model and optimize 7nm manufacturing technology.Share: Facebook Linkedin Twitter
Mergers, acquisitions reshape the automotive semi supplier landscapeCapped by last week's announcement that Qualcomm Inc. would buy CSR PLC, the automotive semiconductor industry recently has been undergoing a wave of merger and acquisition activity that has shaken up the competitive order of the market.Share: Facebook Linkedin Twitter
Gigaphoton achieves 3-hour continuous operation of EUV light sourceGigaphoton Inc. announced that it has succeeded in achieving 3-hour continuous operation of its prototype LPP EUV light source at 50 percent duty cycle and 42-W output, equivalent to usage in a high-volume-manufacturing environment.Share: Facebook Linkedin Twitter
Solid State Watch: Oct. 23-30, 2014GLOBALFOUNDRIES to take over IBM's commercial semi business; MegaChips acquires SiTime; imec and Coventor collaborate; Mergers and acquisitions shake up automotive semiconductor landscapeShare: Facebook Linkedin Twitter
Tech News
Air-gaps in copper Interconnects for logicIntel's "14nm-node" process uses air-gaps in dielectrics; direction disclosed four years ago. (From SemiMD)Share: Facebook Linkedin Twitter
Intel's 14nm parts are finally here!Earlier last week, a couple of laptops arrived from Japan using the Core M version of Intel's Broadwell processor. Straight into the lab, and within a few hours the first sight of the die structure, confirming that it is indeed the 14nm technology.Share: Facebook Linkedin Twitter
SMIC and Maxscend collaborate on 55nm RF IP platformSemiconductor Manufacturing International Corporation and Maxscend Technologies Inc., a RF IP company based in China, announced that Maxscend Bluetooth RF IP has been silicon proven on SMIC's 55nm low leakage logic process. Share: Facebook Linkedin Twitter
EUV light source developer Adlyte achieves key performance milestone for high-volume manufacturingAdlyte Inc., a developer of high-brightness extreme light sources for advanced semiconductor inspection and metrology applications, today announced it has reached a key performance benchmark for its extreme ultraviolet (EUV) light source for high-volume manufacturing-readiness.Share: Facebook Linkedin Twitter
Special UO microscope captures defects in nanotubesUniversity of Oregon chemists have devised a way to see the internal structures of electronic waves trapped in carbon nanotubes by external electrostatic charges.Share: Facebook Linkedin Twitter
Business News
SEMICON Japan 2014: New venue and new ideas for rebounding industrySEMI announced an exceptional lineup of speakers for SEMICON JapanÂ’s Opening Day — Accenture, Applied Materials, ARM, IBM Japan, Intel K.K., NIICT, Scripps, Toshiba, and Toyota. Share: Facebook Linkedin Twitter
TSI Semiconductors and Silvaco extend collaboration to accelerate launch of 0.25um BCDMOS processSilvaco, Inc. (Silvaco) and TSI Semiconductors, LLC (TSI) announced that they have extended their collaboration to accelerate the development and production launch of TSI's 0.25um BCDMOS process technology. Share: Facebook Linkedin Twitter
MegaChips to acquire SiTime for $200MSiTime Corporation, a MEMS and analog semiconductor company, announced that it has signed a definitive agreement under which MegaChips Corporation, a top 25 fabless semiconductor company based in Japan, will acquire SiTime for $200 million in cash.Share: Facebook Linkedin Twitter
Intersil announces appointment of industry executives to board of directorsIntersil Corporation, a provider of innovative power management and precision analog solutions, announced the appointment of two accomplished executives to its board of directors, bringing the total number of independent directors to nine.Share: Facebook Linkedin Twitter
Product News
Next-generation nanoimprint lithography technologyEV Group introduced its SmartNIL large-area nanoimprint lithography (NIL) process.Share: Facebook Linkedin Twitter
VaporSorb filter line protects advanced yield production from EntegrisEntegris, Inc. announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. Share: Facebook Linkedin Twitter
Web Editor
Shannon Davis
603-547-5309
sdavis@extensionmedia.com


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